Knowledge Agora



Similar Articles

Title A new industrial technology for closing the loop of full-size waste motherboards using chemical-ultrasonic-mechanical treatment
ID_Doc 6189
Authors Yousef, S; Tatariants, M; Bendikiene, R; Kriukien, R; Denafas, G
Title A new industrial technology for closing the loop of full-size waste motherboards using chemical-ultrasonic-mechanical treatment
Year 2020
Published
Abstract Development of a new sustainable pilot scale technology for recycling of Waste Printed Circuit Boards (WPCBs) is a challenging and time-consuming task, especially since the situation with electronic waste is worsening yearly in terms of environmental hazard and valuable material loss. Therefore, this research is oriented towards quickly approaching the industrial level and recycling a full-size waste mother-board (MB) using a combined technique presented by three treatment types: chemical, ultrasonic, and mechanical. Here, chemical is the main treatment type with an aim to liquefy Brominated Epoxy Resin (BER) using an organic solvent eventually separating all layers of MB, while mechanical and ultrasonic treatments are used to accelerate the BER dissolution process. The treatment was performed in a new reactor designed especially for that purpose. Spent solvent was regenerated several times during the treatment by a rotary evaporator to avoid solvent saturation as well as to extract the BER. Ultraviolet -Visible Spectroscopy, FTIR, NMR, metallographic microscope, SEM and EDX were the used to study the obtained BER, fiberglass, and metal. The results indicated that MB was composed of five fiberglass layers adhered by BER (67 wt.%), two copper layers and tracks (19.4 wt.%), through-hole pads (12 wt.%). In addi-tion, it was noted that through-hole pads contained Palladium coating. Finally, based on the economic evaluation of the new technology, a conclusion was drawn that the application of this technology on an industrial scale can provide an economic return up to similar to 2,300$ per ton of WPCBs (without precious metals recovery). In addition, applying the developed approach on an industrial scale gives a possibility to decrease carbon footprint by -1868 kg CO2-eq/t of WPCBs. (C) 2020 Institution of Chemical Engineers. Published by Elsevier B.V. All rights reserved.
PDF

Similar Articles

ID Score Article
14559 Yousef, S; Tatariants, M; Tichonovas, M; Bendikiene, R; Denafas, G Recycling of bare waste printed circuit boards as received using an organic solvent technique at a low temperature(2018)
14437 Fazari, J; Hossain, MZ; Charpentier, P A review on metal extraction from waste printed circuit boards (wPCBs)(2024)Journal Of Materials Science, 59, 27
15506 Ping, Z; Liu, XK; Tao, Q; Ma, Y; Wang, YJ; Li, ZL; Wang, JP; Cao, ZB; Hao, Y; Qian, GR Mechanism of Dissolving Tin Solders from Waste Printed Circuit Board Assemblies by Cyclic Fluoboric Acid Composite System(2019)Environmental Engineering Science, 36, 8
29752 Huang, K; Guo, J; Xu, ZM Recycling of waste printed circuit boards: A review of current technologies and treatment status in China(2009)Journal Of Hazardous Materials, 164.0, 2-3
32646 Hao, JJ; Wang, YS; Wu, YF; Guo, F Metal recovery from waste printed circuit boards: A review for current status and perspectives(2020)
22669 Tatariants, M; Yousef, S; Skapas, M; Juskenas, R; Makarevicius, V; Lukosiute, SI; Denafas, G Industrial technology for mass production of SnO2 nanoparticles and PbO2 microcubeimicrocross structures from electronic waste(2018)
Scroll