| Title |
Recovery Of Metals From Printed Circuit Boards By Means Of Electrostatic Separation |
| ID_Doc |
12631 |
| Authors |
Franke, D; Suponik, T; Nuckowski, PM; Golombek, K; Hyra, K |
| Title |
Recovery Of Metals From Printed Circuit Boards By Means Of Electrostatic Separation |
| Year |
2020 |
| Published |
Management Systems In Production Engineering, 28.0, 4 |
| DOI |
10.2478/mspe-2020-0031 |
| Abstract |
Without the use of appropriate recycling technologies, the growing amount of electronic waste in the world can be a threat to the development of new technologies, and in the case of improper waste management, may have a negative impact on the environment. This is due to the fact that this waste contains large amounts of valuable metals and toxic polymers. Therefore, it should be recycled in accordance with the assumptions of the circular economy. The methods of mechanical recovery of metals from electronic waste, including printed circuits, may be widely used in the future by waste management companies as well as metal production and processing companies. That is why, a well-known and easily applicable electrostatic separation (ES) method was used to recover metals from printed circuit boards. The grain class of 0.32 - 0.10 mm, obtained after grinding the boards, was fed to a separator. Feed and separation products were analyzed by means of ICP-AES, SEM/EDS and XRD. The concentrate yield obtained after electrostatic separation amounted to 32.3% of the feed. Its density was 11.1 g/cc. Out of the 91.44% elements identified in the concentrate, over 90% were metals. XRD, SEM observations and EDS analysis confirmed the presence of non-metallic materials in the concentrate. This relatively high content of impurities indicates the need to grind printed circuit board into grain classes smaller than 0.32-0.10 mm. |
| Author Keywords |
electrostatic separation; metals recovery; PCB; SEM; XRD |
| Index Keywords |
Index Keywords |
| Document Type |
Other |
| Open Access |
Open Access |
| Source |
Emerging Sources Citation Index (ESCI) |
| EID |
WOS:000841939200001 |
| WoS Category |
Engineering, Industrial |
| Research Area |
Engineering |
| PDF |
https://doi.org/10.2478/mspe-2020-0031
|