| Title |
Thermo-physical characteristics of 3C-SiC structure subjected to microwave exposure: A molecular dynamics study |
| ID_Doc |
17848 |
| Authors |
Dora, TL; Owhal, A; Roy, T; Belgamwar, SU; Goel, S; Nezhad, HY; Mishra, RR |
| Title |
Thermo-physical characteristics of 3C-SiC structure subjected to microwave exposure: A molecular dynamics study |
| Year |
2023 |
| Published |
|
| DOI |
10.1016/j.mtcomm.2023.105693 |
| Abstract |
Silicon carbide (SiC) is widely used as a susceptor for microwave hybrid heating applications owing to its exceptional microwave absorbing characteristics. In practice, it is challenging to characterize the thermo-physical behaviour of the microwave irradiated SiC-based targets experimentally due to interference of inte-grated measurement devices with microwaves. In this article, molecular dynamics simulations were performed to understand the atomistic response of a bulk 3C-SiC model during microwave heating. Atomistic simulations were performed at different electric field strengths (ranging from 0.1 to 0.5 V/& ANGS;) and frequencies (ranging from 100 to 500 GHz) to develop a numerical relationship between temperature and time in order to predict the thermal response of bulk 3C-SiC. On the other hand, the physical characteristics of the bulk 3C-SiC were determined by the plots between mean square displacement (MSD), time and diffusion coefficients. The results showed that at 0.5 V/& ANGS; electric field strength and 500 GHz frequency, the diffusion coefficient increased up to 88% as compared to the electric field strength of 0.1 V/& ANGS; at 500 GHz. A change of 75% in the physical phase of 3C-SiC structure with respect to the initial structure was confirmed by the distorted density distribution profile. |
| Author Keywords |
Microwave heating; Molecular dynamics; 3C-SiC; Electric field strength; Frequency; Atomistic simulation |
| Index Keywords |
Index Keywords |
| Document Type |
Other |
| Open Access |
Open Access |
| Source |
Science Citation Index Expanded (SCI-EXPANDED) |
| EID |
WOS:001042999300001 |
| WoS Category |
Materials Science, Multidisciplinary |
| Research Area |
Materials Science |
| PDF |
https://doi.org/10.1016/j.mtcomm.2023.105693
|