| Title |
Recovery of valuable BGA components from used electronic mobile devices and their application in new electronic products. |
| ID_Doc |
21240 |
| Authors |
Koscielski, M; Sitek, J; Ciszewski, P; Dawidowicz, P; Arazna, A; Janeczek, K; Steplewski, W; Podhradsky, G; Ambrosch, R |
| Title |
Recovery of valuable BGA components from used electronic mobile devices and their application in new electronic products. |
| Year |
2019 |
| Published |
|
| DOI |
|
| Abstract |
A positive trend towards circular economy in many domains has been observed. This approach is based on reuse, repair activities that would lead to new functional device or a retrofitting that would lead to a new product. The standard period of use of mobile electronic devices is short and although the device as whole or partly might be still functional it usually is recycled as whole. It has been proven that recycling might not be the optimal way to source the materials that would be reused as there is possibility of the use of the components almost as is to bring them to second lift. The presented article focuses on the ball grid array (BGA) chips that are often used in nowadays electronic devices. The sourced chips were retrofitted to a new design devices that has been tested. |
| Author Keywords |
BGA chip recovery; circular economy; reuse; repair; IMC (intermetallic compounds); disassembly; printed circuit boards; reliability tests |
| Index Keywords |
Index Keywords |
| Document Type |
Other |
| Open Access |
Open Access |
| Source |
Conference Proceedings Citation Index - Science (CPCI-S) |
| EID |
WOS:000532694100109 |
| WoS Category |
Engineering, Manufacturing; Engineering, Electrical & Electronic |
| Research Area |
Engineering |
| PDF |
|