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Title 3D-Dspnet: Product Disassembly Sequence Planning
ID_Doc 23299
Authors Upadhyay, A; Ladrecha, B; Dubey, A; Kuriakose, SM; Goenka, P
Title 3D-Dspnet: Product Disassembly Sequence Planning
Year 2022
Published
DOI 10.1109/ICMEW56448.2022.9859434
Abstract Product Disassembly has become an area of active research as it supports sustainable development by aiding effective end-of-life (EOL) stage strategies like reuse, re-manufacturing, recycling, etc. In this work, we propose a new approach, 3D-DSPNet, that can utilize 3D data from CAD assembly models to generate a feasible disassembly sequence. Our approach uses Graph-based learning to process the graph representation of CAD models. Currently, the available 3D CAD model datasets lack ground truth disassembly sequences. We propose and curate a new dataset, the 3D-DSP dataset, which includes ground truth information about the disassembly sequence for 3D product models. We carry out evaluation and analysis of results to explain the efficacy of the proposed method. Our approach significantly outperforms the existing baseline. We develop an Autodesk Fusion 360 plug-in that generates disassembly sequence animation, allowing intuitive analysis of the disassembly plan.
Author Keywords Disassembly Planning; EOL; Circular Economy; CAD
Index Keywords Index Keywords
Document Type Other
Open Access Open Access
Source Conference Proceedings Citation Index - Science (CPCI-S)
EID WOS:000860953900042
WoS Category Computer Science, Artificial Intelligence; Computer Science, Information Systems; Computer Science, Software Engineering; Imaging Science & Photographic Technology
Research Area Computer Science; Imaging Science & Photographic Technology
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