| Title |
Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment |
| ID_Doc |
26871 |
| Authors |
Schischke, K; Manessis, D; Pawlikowski, J; Kupka, T; Krivec, T; Pamminger, R; Glaser, S; Podhradsky, G; Nissen, NF; Schneider-Ramelow, M; Lang, KD |
| Title |
Embedding as a key Board-Level Technology for Modularization and Circular Design of Smart Mobile Products: Environmental Assessment |
| Year |
2019 |
| Published |
|
| DOI |
10.23919/empc44848.2019.8951816 |
| Abstract |
Embedding technologies for heterogeneous integration of active and passive components are a promising approach for functional modules on the printed circuit board level. Modularity and embedding related miniaturization ore key enablers for some upcoming trendy in a Circular Economy: Better serviceability and reparability o "outsourcing" 0 component obso 'ices, reduced material consumption, lower printed circuit board production impacts due to complex.functionality to smaller modules, resilience of the product platform against escence.for longer product life cycles, potentially increased reliability of embedded components. For a broader.framing of the modularity discussion, this paper also gives an outlook on other modular approaches in the field of mobile devices and smartphones in particular. The embedding technology with its miniaturization potential might reduce the total environmental impacts of manufacturing printed circuit board assemblies, supporting Circular Economy strategies. The additional environmental.footprint of modularising a smartphone in a way done by Fairphone increases the manufacturing-related greenhouse gas emissions by 4,6%. Embedding targeting at a better serviceability, but not necessarily simplifying do-ityourself repairs only slightly increases the carbon.footprint in absolute terms. In case of a digital voice recorder this additional carbon.1botprint is 0,66 kg COs-eq. compared to an add-on of 1,64 kg CO3-eq..for Fairphone's 1110(11( oriza t ion approach. |
| Author Keywords |
environmental Life Cycle Assessment; carbon footprint; component embedding |
| Index Keywords |
Index Keywords |
| Document Type |
Other |
| Open Access |
Open Access |
| Source |
Conference Proceedings Citation Index - Science (CPCI-S) |
| EID |
WOS:000532694100041 |
| WoS Category |
Engineering, Manufacturing; Engineering, Electrical & Electronic |
| Research Area |
Engineering |
| PDF |
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