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Scientific Article details

Title Patent analysis of chemical treatment technology for wastewater: Status and future trends
ID_Doc 32282
Authors Sun, XZ; Jin, LL; Zhou, FY; Jin, K; Wang, LC; Zhang, XX; Ren, HQ; Huang, H
Title Patent analysis of chemical treatment technology for wastewater: Status and future trends
Year 2022
Published
DOI 10.1016/j.chemosphere.2022.135802
Abstract In order to reveal the status and trends of chemical treatment for wastewater, the patents analysis from both structured and unstructured data was performed in this study. 35,838 patents recorded in the Derwent Inno-vation Index database were adopted. The results showed that China was the country with the largest number of patents in the field, and the United States was the main exporter of international technology flows. Chemical processes combined with biological and physical processes was the mainstream, and ozonation and electro-chemical treatment were the major single technologies. Technology evolution path generally showed the tran-sition from biological process-combined chemical treatment to electrochemical treatment and finally to physical process-combined chemical treatment. Furthermore, future trends were revealed from both patents and papers. It demonstrated that efficient removal of ammonia nitrogen, green water treatment agents and resourcezation of wastewater were the key innovation directions, and technologies with regard to efficient use of energy (including photocatalytic technology and microbial fuel cell) were the main research hotspots. Overall, this study provided a comprehensive understanding for the research and application of chemical treatment for wastewater technologies.
Author Keywords Chemical treatment for wastewater; Patent analysis; Technology evolution path; Future trends
Index Keywords Index Keywords
Document Type Other
Open Access Open Access
Source Science Citation Index Expanded (SCI-EXPANDED)
EID WOS:000861020900006
WoS Category Environmental Sciences
Research Area Environmental Sciences & Ecology
PDF http://manuscript.elsevier.com/S0045653522022950/pdf/S0045653522022950.pdf
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