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Title Complex Problems Solution as a Service Based on Predictive Optimization and Tasks Orchestration in Smart Cities
ID_Doc 44264
Authors Ahmad, S; Ali, J; Jamil, F; Whangbo, TK; Kim, D
Title Complex Problems Solution as a Service Based on Predictive Optimization and Tasks Orchestration in Smart Cities
Year 2021
Published Cmc-Computers Materials & Continua, 69, 1
DOI 10.32604/cmc.2021.017773
Abstract Smart cities have different contradicting goals having no apparent solution. The selection of the appropriate solution, which is considered the best compromise among the candidates, is known as complex problem-solving. Smart city administrators face different problems of complex nature, such as optimal energy trading in microgrids and optimal comfort index in smart homes, to mention a few. This paper proposes a novel architecture to offer complex problem solutions as a service (CPSaaS) based on predictive model optimization and optimal task orchestration to offer solutions to different problems in a smart city. Predictive model optimization uses a machine learning module and optimization objective to compute the given problem's solutions. The task orchestration module helps decompose the complex problem in small tasks and deploy them on real-world physical sensors and actuators. The proposed architecture is hierarchical and modular, making it robust against faults and easy to maintain. The proposed architecture's evaluation results highlight its strengths in fault tolerance, accuracy, and processing speed.
Author Keywords Internet of things; complex problem solving; task modeling; embedded IoT systems; predictive optimization; artificial cognition; task orchestration
Index Keywords Index Keywords
Document Type Other
Open Access Open Access
Source Science Citation Index Expanded (SCI-EXPANDED)
EID WOS:000659047600001
WoS Category Computer Science, Information Systems; Materials Science, Multidisciplinary
Research Area Computer Science; Materials Science
PDF https://www.techscience.com/ueditor/files/cmc/TSP_CMC_69-1/TSP_CMC_17773/TSP_CMC_17773.pdf
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