| Title |
Removal of nickel from chemical plating waste solution through precipitation and production of microsized nickel hydroxide particles |
| ID_Doc |
7178 |
| Authors |
Tsai, TH; Chou, HW; Wu, YF |
| Title |
Removal of nickel from chemical plating waste solution through precipitation and production of microsized nickel hydroxide particles |
| Year |
2020 |
| Published |
|
| DOI |
10.1016/j.seppur.2020.117315 |
| Abstract |
Chemical plating of nickel is widely used in wafer packaging. However, frequent renewal of plating baths generates a large amount of waste solution. When hazardous Ni2+ ions are removed from waste solutions through chemical precipitation, the complexing agent in the solution hinders nickel removal and reduces the nickel hydroxide [Ni(OH)(2)] precipitate size to approximately 0.5 mu m. This study revealed that the precipitation rate of Ni(OH)(2) can be controlled by the pH, temperature, and agitation. Furthermore, a Ni removal efficiency of more than 98% can be achieved. X-ray diffraction analysis revealed that the recovered particles included amorphous Ni(OH)(2) and alpha-Ni(OH)(2), indicating a high potential for energy conversion in nickel-based secondary batteries. Therefore, the proposed method can be used to sustain a circular economy by creating a Ni waste-toenergy cycle. |
| Author Keywords |
Nickel; Chemical plating waste solution; Precipitation; Microsized particles |
| Index Keywords |
Index Keywords |
| Document Type |
Other |
| Open Access |
Open Access |
| Source |
Science Citation Index Expanded (SCI-EXPANDED) |
| EID |
WOS:000564716400013 |
| WoS Category |
Engineering, Chemical |
| Research Area |
Engineering |
| PDF |
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