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Title Sustainability Assessment of Taiwan's Semiconductor Industry: A New Hybrid Model Using Combined Analytic Hierarchy Process and Two-Stage Additive Network Data Envelopment Analysis
ID_Doc 73315
Authors Lin, FY; Lin, SW; Lu, WM
Title Sustainability Assessment of Taiwan's Semiconductor Industry: A New Hybrid Model Using Combined Analytic Hierarchy Process and Two-Stage Additive Network Data Envelopment Analysis
Year 2018
Published Sustainability, 10, 11
DOI 10.3390/su10114070
Abstract Sustainable development has become the biggest concern of the semiconductor industry, which plays a vital role not only in technology breakthroughs, but also by serving as an enabler for sustainability. This study combines Analytic Hierarchy Process (AHP) and additive network Data Envelopment Analysis (DEA) to measure the sustainable performance which are derived from business growth stage and energy utilization stage through the parametric linear program. Meanwhile, this method makes up the disadvantage of the weighting technique used additive decomposition approach to the two-stage network and avoids biasing toward the second stage. The findings demonstrate that Taiwan's semiconductor manufacturing sector has exhibited a steady increase in its overall trend of sustainability performance. According to the stage-level performance results, the performance of business growth is better than energy utilization. However, the changing trend of overall sustainability performance is through a steady increase from environmental efficiency and not from economic efficiency.
Author Keywords sustainability assessment; Data Envelopment Analysis (DEA); semiconductor industry
Index Keywords Index Keywords
Document Type Other
Open Access Open Access
Source Science Citation Index Expanded (SCI-EXPANDED); Social Science Citation Index (SSCI)
EID WOS:000451531700244
WoS Category Green & Sustainable Science & Technology; Environmental Sciences; Environmental Studies
Research Area Science & Technology - Other Topics; Environmental Sciences & Ecology
PDF https://www.mdpi.com/2071-1050/10/11/4070/pdf?version=1542001215
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